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10.04.2019 Idonus Sarl B - Equipements

HF Vapor Phase Etcher

The VPE consists of a reaction chamber and a lid. A heating element is integrated in the lid. It controls the temperature of the substrate to be etched.

Wafer clamping can be achieved in two ways: Wafers can be clamped mechanically by using the clamping ring. The screwing is done from the backside of the apparatus, which is never in contact with the HF vapor. The 3 nuts are easy to handle with protection gloves. The other option is electrostatic clamping. Single chips (longer than 10 mm) as well as wafers can be clamped to the heating element. The backside of the wafer is protected from etching.

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HF Vapor Phase Etcher

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