THE MICROTECHNOLOGY INFORMATION PORTAL/THE SHOW
20.04.2023
A - Machines
SOMOS Diamond wire saws
SOMOS diamond wire saws are ideal for cutting hard and ultra-hard materials, such as silicon, silicon carbide, quartz, sapphire, graphite, ruby and natural stones.
The part to be cut is glued on a sacrificial beam, and the diamond wire, which is continuously wound and unwound, removes material at the programmed feed rate.
They are equipped with wire breakage detection systems, to automatically stop the machine in the event of breakage. Wire tension and speeds can be adjusted to suit the material to be cut.
The use of this type of technology reduces material losses compared with more conventional alternatives.
NCS and NCX single-wire saws
These two machine models enable slice-by-slice cutting. They are ideal for low-to-medium-volume production, or where flexibility is required, with cutting thicknesses that often vary.
RTD and MWX multi-wire saws
RTD and MWX machines are ideal for cutting hard and brittle materials very productively.
As with single-wire machines, cutting is performed by a continuously wound diamond wire. On multi-wire machines, a layer of diamond wires enables numerous slices to be cut at the same time.
They are ideal for high-volume production of wafers of identical thickness.